RADCOM’s unmatched processing engine
RADCOM’s GearSet™ (patent pending) is the company’s proprietary three-chip solution and positions RADCOM as the industry leader in the high-performance communication monitoring solutions market. The GearSet allows one platform to monitor triple-play services at unprecedented processing rates, giving service providers the advantage they need to compete in a constantly changing environment.
Quadruple-play creating opportunities for RADCOM
The industry's shift to quadruple-play (voice, video, data and mobile) continues to create new opportunities for RADCOM. As new technologies and services become integrated into an increasingly complex telecom environment, operators view RADCOM's solutions as critical for achieving and maintaining quality of service.
Technology
The GearSet is a three-chip session processor designed to provide unmatched wirespeed monitoring performance, independent of technologies or services, on all layers. It allows one platform to monitor UMTS, CDMA, IMS, SDP, VoIP and IPTV.
The GearSet revolutionizes online processing by offering session-level parsing, classifying, filtering, capturing and deep-packet analysis at line rates from E1/T1 up to 10 Gbps.
The GearSet also makes it possible for RADCOM to rapidly develop and roll out new applications by means of its flexible and scalable architecture and nearly unlimited customization capabilities.
The GearSet is an expansion of the revolutionary GEAR chip, offering higher performance, yet compatible with former solutions.
Features
- Line rates from E1/T1 up to 10GbE
- Session builder working in conjunction with the dedicated Control plane processor
- Programmable classifier to support multiple simultaneous protocol stacks
- Line rate support of multiple simultaneous services
- Large number of programmable, flexible line-rate filters
- User and/or Control plane capture
- Packet by packet capture
- Technology- and service-independent
- Nearly unlimited customization with high-speed programmable HW modules
Technical Specifications
- Number of chips: 3
- Chip process: 90 nm
- Data processing level: Sessions at the application layer
- Internal bus widths: 64/128 bit
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